The investigation of 193nm CPL 3D topology mask effect on wafer process performanceYUNG FENG CHENG; YUEH LIN CHOU; CHUEN HUEI YANG et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6197-0, vol 2, 61542D.1-61542D.12Conference Paper

The Influence and Improvement of Through Pellicle Image PlacementWEI CYUAN LO; YUNG FENG CHENG; MING JUI CHEN et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 8166, issn 0277-786X, isbn 978-0-8194-8791-9, 81663A.1-81663A.7, 2Conference Paper

Feasibility Study of Splitting Pitch Technology on 45nm Contact Patterning with 0.93 NAYUNG FENG CHENG; YUEH LIN CHOU; TING CHENG TSENG et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65202N.1-65202N.8, issn 0277-786X, isbn 978-0-8194-6639-6Conference Paper

Wafer LMC Accuracy Improvement by Adding Mask ModelWEI CYUAN LO; YUNG FENG CHENG; MING JUI CHEN et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7640, issn 0277-786X, isbn 978-0-8194-8054-5 0-8194-8054-1, 76402S.1-76402S.8, 2Conference Paper

Scatterometry measurements of line end shortening structures for focus- exposure monitoringHUNG, Kelvin; YUNG FENG CHENG; JIE WEI SUN et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6195-4, 2Vol, vol 1, 61521W.1-61521W.12Conference Paper

Inspection of integrated circuit database through reticle and wafer simulation : the lithography process window performance monitoringBO SU; VERMA, Gaurav; LIN, C. L et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, issn 0277-786X, isbn 0-8194-6014-1, 2Vol, Part 2, 599244.1-599244.14Conference Paper